Name
Title | ||
|---|---|---|
NeurFill: Migrating Full-Chip CMP Simulators to Neural Networks for Model-Based Dummy Filling Synthesis |
Abstract | ||
|---|---|---|
Dummy filling is widely applied to significantly improve the planarity of topographic patterns for the chemical mechanical polishing (CMP) process in VLSI manufacturing. This paper proposes a novel model-based dummy filling synthesis framework NeurFill, integrated with multiple starting points-sequential quadratic programming (MSP-SQP) optimization solver. Inside this framework, a full-chip CMP si... |
Year | DOI | Venue |
|---|---|---|
2021 | 10.1109/DAC18074.2021.9586325 | 2021 58th ACM/IEEE Design Automation Conference (DAC) |
Keywords | DocType | ISSN |
Backpropagation,Semiconductor device modeling,Design automation,Neural networks,Very large scale integration,Filling,Manufacturing | Conference | 0738-100X |
ISBN | Citations | PageRank |
978-1-6654-3274-0 | 0 | 0.34 |
References | Authors | |
0 | 6 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Junzhe Cai | 1 | 0 | 0.68 |
| Changhao Yan | 2 | 27 | 6.64 |
| Yuzhe Ma | 3 | 0 | 0.34 |
| Bei Yu | 4 | 656 | 74.07 |
| Dian Zhou | 5 | 260 | 56.14 |
| Xuan Zeng | 6 | 408 | 75.96 |