Paper Info
Title
Analysis of Resistance Distribution and Voltage Drop in Chips with Inductive Coupling Wireless Communication Interface
Abstract
The building block computing system can build several systems by stacking small chips with inductive coupling wireless chip-to-chip connection TCI (Through Chip Interface). TCI IP (Intellectual Property) was developed by using the Renesas 65nm SOTB process, and several family chips have been developed with the IP. Although all of the chips worked alone without problems, when they were stacked to c...
Year
DOI
Venue
2021
10.1109/CANDARW53999.2021.00055
2021 Ninth International Symposium on Computing and Networking Workshops (CANDARW)
Keywords
DocType
ISBN
Wireless communication,Couplings,Resistance,Transmitters,Stacking,Layout,Voltage
Conference
978-1-6654-2835-4
Citations 
PageRank 
References 
0
0.34
0
Authors
2
Name
Order
Citations
PageRank
Hideto Kayashima100.68
Hideharu Amano21375210.21