Name
Abstract | ||
|---|---|---|
This paper presents a novel method to estimate the power consumption of distinct active components on an electronic carrier board by using thermal imaging. The components and the board can be made of heterogeneous material such as plastic, coated microchips, and metal bonds or wires, where a special coating for high emissivity is not required. The thermal images are recorded when the components on... |
Year | DOI | Venue |
|---|---|---|
2021 | 10.1109/TCE.2021.3122076 | IEEE Transactions on Consumer Electronics |
Keywords | DocType | Volume |
Estimation,Power measurement,Cameras,Temperature measurement,Energy measurement,Thermal resistance,Smart phones | Journal | 67 |
Issue | ISSN | Citations |
4 | 0098-3063 | 0 |
PageRank | References | Authors |
0.34 | 0 | 4 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Christian Herglotz | 1 | 0 | 0.34 |
| Simon Grosche | 2 | 1 | 2.06 |
| Akarsh Bharadwaj | 3 | 0 | 0.34 |
| André Kaup | 4 | 0 | 0.34 |