Name
Abstract | ||
|---|---|---|
In this work an implicit finite element model of a Printed Circuit Board (PCB), connectors, and stiffener is developed. The effect of several parameters on the strain distribution on the board was analyzed. The PCB was bolted to an aluminum stiffener. The simulation went through several steps to consider the effect of the solder reflow process as well as bolt pretention forces and plug-in forces o... |
Year | DOI | Venue |
|---|---|---|
2022 | 10.1109/IRPS48227.2022.9764416 | 2022 IEEE International Reliability Physics Symposium (IRPS) |
Keywords | DocType | ISBN |
Semiconductor device modeling,Connectors,Temperature measurement,Current measurement,Fasteners,Data models,Numerical models | Conference | 978-1-6654-7950-9 |
Citations | PageRank | References |
0 | 0.34 | 0 |
Authors | ||
6 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| M. Hamid | 1 | 0 | 0.34 |
| K. O’Connell | 2 | 0 | 0.34 |
| J. Bielick | 3 | 0 | 0.34 |
| Michael J. Bennett | 4 | 16 | 5.05 |
| E. Campbell | 5 | 0 | 0.34 |
| A. Alfoqaha | 6 | 0 | 0.34 |