Abstract | ||
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Information about the root system architecture of plants is of great value in modern crop science. However, there is a dearth of tools that can provide field-scale measurements of below-ground parameters in a non-destructive and non-invasive fashion. In this brief, we propose a multi-modal, non-contact thermoacoustic sensing system to address this measurement gap and discuss various system design ... |
Year | DOI | Venue |
---|---|---|
2022 | 10.1109/TCSII.2022.3159448 | IEEE Transactions on Circuits and Systems II: Express Briefs |
Keywords | DocType | Volume |
Soil,Sensors,Microwave imaging,Microwave circuits,Ventilators,Ultrasonic imaging,Imaging | Journal | 69 |
Issue | ISSN | Citations |
5 | 1549-7747 | 0 |
PageRank | References | Authors |
0.34 | 0 | 5 |
Name | Order | Citations | PageRank |
---|---|---|---|
Ajay Singhvi | 1 | 1 | 0.69 |
Aidan Fitzpatrick | 2 | 1 | 1.03 |
Johannes Daniel Scharwies | 3 | 0 | 0.34 |
Jose R. Dinneny | 4 | 0 | 0.34 |
amin arbabian | 5 | 227 | 35.52 |