Author Info
Name
Affiliation
Papers
SHUNSUKE NEMOTO
Natl Inst Adv Ind Sci & Technol, NeRI, Nanoelect Res Inst NeRI, AIST Tsukuba Cent 2,1-1-1 Umezono, Tsukuba, Ibaraki, Japan
3
Collaborators
Citations 
PageRank 
11
0
1.01
Referers 
Referees 
References 
0
29
7
Title
Citations
PageRank
Year
Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits.00.342017
Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits.00.342016
Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging00.342013