Author Info
Name
Affiliation
Papers
M.G. VALENTINI
STMicroelectronics, via C. Olivetti 2, 20041 Agrate Brianza, Italy
1
Collaborators
Citations 
PageRank 
4
0
0.34
Referers 
Referees 
References 
0
1
1
Title
Citations
PageRank
Year
Reliability assessment of multi-via Cu-damascene structures by wafer-level isothermal electromigration tests00.342007