Name
Affiliation
Papers
JONG TAE PARK
Department of Electronics Engineering, University of Incheon, #177 Dohwa-Dong Nam-Gu, Incheon 402-749, Republic of Korea
31
Collaborators
Citations 
PageRank 
64
27
12.40
Referers 
Referees 
References 
81
172
64
Search Limit
100172
Title
Citations
PageRank
Year
Thermal energy harvesting circuit with maximum power point tracking control for self-powered sensor node applications.10.362018
Effects of the compositional ratios of sputtering target on the device performance and instability in amorphous InGaZnO thin film transistors.00.342018
Secure Mobility Management Using CoAP in the Internet of Things00.342018
Negative bias illumination stress instability in amorphous InGaZnO thin film transistors with ITO local conducting buried layer.00.342017
Design and implementation of an interoperable messaging system for IoT healthcare services00.342017
Reliability of amorphous InGaZnO TFTs with ITO local conducting buried layer for BEOL power transistors.00.342017
A Mechanism for Reliable Mobility Management for Internet of Things Using CoAP.10.382017
Nanowire width dependence of data retention and endurance characteristics in nanowire SONOS flash memory.00.342016
Negative bias illumination stress instability in amorphous InGaZnO thin film transistors with transparent source and drain.00.342016
Design and implementation of interoperable IoT healthcare system based on international standards20.452016
Device instability of amorphous InGaZnO thin film transistors with transparent source and drain.00.342016
Impact of work function of the silicon bottom-gates on electrical instability in InGaZnO thin film transistors.00.342016
Wire width dependence of hot carrier degradation in silicon nanowire gate-all-around MOSFETs00.342015
Mobile CoAP for IoT mobility management40.442015
Effect of source and drain asymmetry on hot carrier degradation in vertical nanowire MOSFETs00.342015
Investigation on stress induced hump phenomenon in IGZO thin film transistors under negative bias stress and illumination00.342015
Hot carrier and PBTI induced degradation in silicon nanowire gate-all-around SONOS MOSFETs.10.632014
Thermo-mechanical reliability optimization of MEMS-based quartz resonator using validated finite element model.20.412012
Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods.30.512012
The optimum fin width in p-MuGFETs with the consideration of NBTI and hot carrier degradation00.342010
NBTI and hot carrier effect of Schottky-barrier p-MOSFETs00.342010
NBTI and hot carrier effect of SOI p-MOSFETs fabricated in strained Si SOI wafer10.372009
NBTI and hot-carrier effects in accumulation-mode Pi-gate pMOSFETs20.672009
Dynamic Path Management with Resilience Constraints under Multiple Link Failures in MPLS/GMPLS Networks10.352008
Hierarchical mobile network binding scheme for route optimization in NEMO80.622007
Comparative study of NBTI as a function of Si film orientation and thickness in SOI pMOSFETs00.342007
New experimental findings on hot-carrier-induced degradation in lateral DMOS transistors00.342006
Reliability improvement by the suppression of keyhole generation in W-plug vias00.342005
Panel two: Ubiquitous computing and communications: challenges in the management of ubiquitous computing and communication00.342004
Hot electron induced punchthrough voltage of p-channel SOI MOSFET’s at room and elevated temperatures00.342003
Increased hot carrier effects in Gate-All-Around SOI nMOSFET’s10.792003