Title
NBTI and hot carrier effect of SOI p-MOSFETs fabricated in strained Si SOI wafer
Abstract
Comparative study on NBTI and hot carrier effects of p-channel MOSFETs fabricated by using strained SOI wafer and unstrained SOI wafer has been performed, respectively. It is observed that NBTI and hot carrier degradation are more significant in strained SOI devices compared with unstrained SOI devices. Since the devices fabricated in strained SOI wafer are SiGe free strained devices, the more generation of interface states during gate oxidation is the main cause for enhanced NBTI and hot carrier degradation in strained SOI devices.
Year
DOI
Venue
2009
10.1016/j.microrel.2009.06.015
Microelectronics Reliability
Keywords
Field
DocType
comparative study
Silicon on insulator,Wafer,Hot carrier degradation,Electric stress,Electronic engineering,Hot carrier effect,Stress (mechanics),Negative-bias temperature instability,Engineering,MOSFET
Journal
Volume
Issue
ISSN
49
9
0026-2714
Citations 
PageRank 
References 
1
0.37
2
Authors
6
Name
Order
Citations
PageRank
Yong Woo Jeon110.37
Dae Hyun Ka210.71
Chong Gun Yu343.83
Won-Ju Cho424.38
M. Saif Islam511.38
Jong Tae Park62712.40