Characterization of stress distribution in ultra-thinned DRAM wafer | 0 | 0.34 | 2015 |
Review Of Wafer-Level Three-Dimensional Integration (3di) Using Bumpless Interconnects For Tera-Scale Generation | 1 | 0.43 | 2015 |
Impact of Thermomechanical Stresses on Ultra-thin Si Stacked Structure | 1 | 0.48 | 2014 |
Reliability analysis of real-time control systems in industrial wireless network | 0 | 0.34 | 2013 |
VLC-TDOA Using Sinusoidal Pilot Signal | 3 | 0.45 | 2013 |
Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures. | 2 | 0.58 | 2011 |
Video word balloon authoring system | 0 | 0.34 | 2011 |
Mobile advertisement system using data push scheduling based on user preference | 6 | 0.63 | 2009 |