| Thermo-mechanical characterization of passive stress sensors in Si interposer | 0 | 0.34 | 2015 |
| Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration | 1 | 0.48 | 2013 |
| 3D integration demonstration of a wireless product with design partitioning. | 2 | 0.99 | 2011 |
