Name
Year | DOI | Venue |
|---|---|---|
2011 | 10.1109/3DIC.2012.6262962 | 3DIC |
Keywords | Field | DocType |
copper,integrated circuit packaging,packaging,tsv,stacking,assembly,integrated circuit design | Wireless,Final product,Integrated circuit packaging,Manufacturing engineering,Integrated circuit design,Brick,Engineering,Embedded system,Stacking | Conference |
Citations | PageRank | References |
2 | 0.99 | 0 |
Authors | ||
27 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| G. Druais | 1 | 2 | 0.99 |
| Pascal Ancey | 2 | 4 | 2.65 |
| C. Aumont | 3 | 2 | 0.99 |
| V. Caubet | 4 | 2 | 0.99 |
| Laurent-Luc Chapelon | 5 | 3 | 1.43 |
| C. Chaton | 6 | 2 | 0.99 |
| Séverine Cheramy | 7 | 22 | 4.74 |
| S. Cordova | 8 | 2 | 0.99 |
| E. Cirot | 9 | 2 | 0.99 |
| J.-P. Colonna | 10 | 3 | 1.40 |
| P. Coudrain | 11 | 20 | 5.00 |
| T. Divel | 12 | 2 | 0.99 |
| Y. Dodo | 13 | 2 | 0.99 |
| Alexis Farcy | 14 | 16 | 5.88 |
| N. Guitard | 15 | 4 | 3.07 |
| K. Haxaire | 16 | 2 | 0.99 |
| Nicolas Hotellier | 17 | 3 | 1.81 |
| F. Leverd | 18 | 2 | 0.99 |
| R. Liou | 19 | 2 | 0.99 |
| J. Michailos | 20 | 15 | 2.65 |
| A. Ostrovsky | 21 | 2 | 0.99 |
| Sebastien Petitdidier | 22 | 2 | 0.99 |
| J. Pruvost | 23 | 2 | 0.99 |
| D. Riquet | 24 | 2 | 0.99 |
| O. Robin | 25 | 2 | 0.99 |
| E. Saugier | 26 | 5 | 1.43 |
| Nicolas Sillon | 27 | 5 | 1.77 |