Author Info
Name
Affiliation
Papers
YUE YING ONG
Institute of Microelectronics, 11 Science Park Road, Singapore Science Park II, Singapore 117685, Singapore
2
Collaborators
Citations 
PageRank 
21
1
0.77
Referers 
Referees 
References 
4
23
5
Title
Citations
PageRank
Year
Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package00.342010
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages10.432009