Name
Title | ||
|---|---|---|
Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package |
Abstract | ||
|---|---|---|
This paper reports the design, assembly and reliability assessment of 21×21mm2 Cu/low-k flip chip (65nm node) with 150μm bump pitch and high bump density. To reduce the stress from the solder bump pad to low-k layers, Metal Redistribution Layer (RDL) and Polymer Encapsulated Dicing Lane (PEDL) are applied to the Cu/low-k wafer. Lead-free Sn2.5Ag, high-lead Pb5Sn and Cu-post/Sn37Pb bumps are evaluated as the first-level interconnects. It is found that the flip chip assembly of high-lead bumped test vehicle requires the right choice of flux and good alignment between the high-lead solder bumps and substrate pre-solder alloy to ensure proper solder bump and substrate pre-solder alloy wetting. Joint Electron Device Engineering Council (JEDEC) standard reliability is performed on the test vehicle with different first-level interconnects, underfill materials and PEDL. |
Year | DOI | Venue |
|---|---|---|
2010 | 10.1016/j.microrel.2010.03.010 | Microelectronics Reliability |
Keywords | Field | DocType |
chip,flip chip | Flip chip,Electronic packaging,Chip,Electronic engineering,Redistribution layer,Soldering,Thermal copper pillar bump,Engineering,Wafer dicing,Integrated circuit | Journal |
Volume | Issue | ISSN |
50 | 7 | 0026-2714 |
Citations | PageRank | References |
0 | 0.34 | 3 |
Authors | ||
20 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Yue Ying Ong | 1 | 1 | 0.77 |
| Soon Wee Ho | 2 | 1 | 1.10 |
| Kripesh Vaidyanathan | 3 | 1 | 1.44 |
| Vasarla Nagendra Sekhar | 4 | 0 | 0.34 |
| Ming Chinq Jong | 5 | 0 | 0.34 |
| Samuel Lim Yak Long | 6 | 0 | 0.34 |
| Vincent Lee Wen Sheng | 7 | 0 | 0.34 |
| Leong Ching Wai | 8 | 3 | 1.77 |
| Vempati Srinivasa Rao | 9 | 0 | 0.68 |
| Jimmy Ong | 10 | 0 | 0.34 |
| Xuefen Ong | 11 | 1 | 0.77 |
| X.W. Zhang | 12 | 32 | 8.97 |
| Yoon Uk Seung | 13 | 0 | 1.01 |
| John H. Lau | 14 | 4 | 1.52 |
| Yeow Kheng Lim | 15 | 1 | 0.77 |
| David Yeo | 16 | 1 | 0.77 |
| Kai Chong Chan | 17 | 1 | 0.77 |
| Yanfeng Zhang | 18 | 170 | 15.56 |
| Juan Boon Tan | 19 | 1 | 0.77 |
| Dong Kyun Sohn | 20 | 1 | 0.77 |