Author Info
Name
Affiliation
Papers
S. K. KANG
IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, New York
2
Collaborators
Citations 
PageRank 
20
18
2.87
Referers 
Referees 
References 
71
50
5
Title
Citations
PageRank
Year
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections182.532008
Electrical properties of highly reliable 32Mb FRAM with advanced capacitor technology00.342005