| CCECE 2021 Invited Paper: Holistic Performance, Reliability and Thermal Understanding of HPC Real Utilization on Silicon Architecture | 0 | 0.34 | 2021 |
| 3D-IC technologies and 3D FPGA | 0 | 0.34 | 2015 |
| Advancing high performance heterogeneous integration through die stacking. | 5 | 0.86 | 2012 |
