Name
Title | ||
|---|---|---|
CCECE 2021 Invited Paper: Holistic Performance, Reliability and Thermal Understanding of HPC Real Utilization on Silicon Architecture |
Abstract | ||
|---|---|---|
The power density and total power from the package have been increased significantly. The rapid rate of power density increases from one generation to the next not only happens at the device level but also happens at the localized area on the devices. The objective of this study is to build more understanding of the localized high-power density in silicon blocks with respect to the impact in tempe... |
Year | DOI | Venue |
|---|---|---|
2021 | 10.1109/CCECE53047.2021.9569128 | 2021 IEEE Canadian Conference on Electrical and Computer Engineering (CCECE) |
Keywords | DocType | ISSN |
Temperature sensors,Resistance,Power system measurements,Density measurement,Power distribution,Silicon,Transistors | Conference | 0840-7789 |
ISBN | Citations | PageRank |
978-1-6654-4864-2 | 0 | 0.34 |
References | Authors | |
0 | 7 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Gamal Refai-Ahmed | 1 | 0 | 0.34 |
| Hoa Do | 2 | 0 | 0.34 |
| I-Ru Chen | 3 | 0 | 0.34 |
| Jae-Gyung Ahn | 4 | 3 | 1.92 |
| Huayan Wang | 5 | 0 | 0.34 |
| Xin Wu | 6 | 5 | 1.54 |
| Ramalingam, S. | 7 | 2 | 1.43 |