Author Info
Name
Affiliation
Papers
H.J. CHANG
Department of Electronic Engineering, Dan-Kook University, Cheonan 330-714, South Korea
1
Collaborators
Citations 
PageRank 
5
4
1.09
Referers 
Referees 
References 
15
0
0
Title
Citations
PageRank
Year
Isothermal aging characteristics of Sn–Pb micro solder bumps41.092003