Author Info
Name
Affiliation
Papers
ZHENSONG XU
Huazhong Univ Sci & Technol, State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Peoples R China
1
Collaborators
Citations 
PageRank 
4
6
0.71
Referers 
Referees 
References 
20
19
6
Title
Citations
PageRank
Year
Defect inspection of flip chip solder bumps using an ultrasonic transducer60.712013