Author Info
Name
Affiliation
Papers
CHAO WANG
School of Materials Science and EngineeringBeijing University of Technology100 Ping Le YuanChaoyang DistrictBeijing100024PR China
1
Collaborators
Citations 
PageRank 
3
1
0.40
Referers 
Referees 
References 
3
4
1
Title
Citations
PageRank
Year
A new creep–fatigue life model of lead-free solder joint10.402015