Name
Abstract | ||
|---|---|---|
•Creep and fatigue damage are accumulated in different loading stage.•A new life prediction model was proposed under high strain rate.•Bilinear interaction diagram modification can improve the new model accuracy. |
Year | DOI | Venue |
|---|---|---|
2015 | 10.1016/j.microrel.2015.03.019 | Microelectronics Reliability |
Keywords | Field | DocType |
Solder joint,Creep,Fatigue,Life prediction | Strain rate,Electronic product,Creep,Electronic packaging,Soldering,Engineering,Reliability design,Reliability engineering,Structural engineering | Journal |
Volume | Issue | ISSN |
55 | 7 | 0026-2714 |
Citations | PageRank | References |
1 | 0.40 | 1 |
Authors | ||
4 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Yongxin Zhu | 1 | 466 | 58.07 |
| xiaoyan li | 2 | 111 | 19.70 |
| Chao Wang | 3 | 1 | 0.40 |
| Ruiting Gao | 4 | 1 | 0.40 |