| CCECE 2021 Invited Paper: Holistic Performance, Reliability and Thermal Understanding of HPC Real Utilization on Silicon Architecture | 0 | 0.34 | 2021 |
| HBM package integration: Technology trends, challenges and applications | 0 | 0.34 | 2016 |
| Interconnect and package design of a heterogeneous stacked-silicon FPGA | 1 | 0.41 | 2013 |
| Working towards an international ANPR Standard — An initial investigation into the UK standard | 1 | 0.34 | 2012 |
