Author Info
Name
Affiliation
Papers
GEERT VAN DER PLAS
IMEC, Leuven, Belgium
2
Collaborators
Citations 
PageRank 
9
0
0.68
Referers 
Referees 
References 
0
29
6
Title
Citations
PageRank
Year
Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited)00.342021
Evaluation of energy-recovering interconnects for low-power 3D stacked ICs00.342009