Author Info
Name
Affiliation
Papers
A. RADISIC
Imec, Kapeldreef 75, Leuven B-3001, Belgium
1
Collaborators
Citations 
PageRank 
8
5
1.09
Referers 
Referees 
References 
25
1
1
Title
Citations
PageRank
Year
Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures51.092010