Author Info
Name
Affiliation
Papers
IMED JANI
CEA, LETI, MINATEC Campus, F-38054 Grenoble, France
3
Collaborators
Citations 
PageRank 
20
1
1.30
Referers 
Referees 
References 
17
31
6
Title
Citations
PageRank
Year
Test Solutions for High Density 3D-IC Interconnects - Focus on SRAM-on-Logic Partitioning00.342019
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability00.342018
Innovative structures to test bonding alignment and characterize high density interconnects in 3D-IC10.632017