Name
Title | ||
|---|---|---|
Innovative structures to test bonding alignment and characterize high density interconnects in 3D-IC |
Abstract | ||
|---|---|---|
3D integration is a promising solution to meet the increased need for functionality, density and performance of future integrated circuits. But it is necessary to have a high interconnection density to reach a significant performance gain in 3D Integrated Circuits (3D-IC). The Cu-Cu hybrid bonding can offer higher interconnects density (Pitch around 2μm or less), but that generates new challenges for test and characterization. This paper focuses on test and characterization of Cu-Cu interconnects and propose smart test vehicles to measure several information after bonding: perfect alignment, misalignment (direction, value) and contact resistance. These test structures are implemented without active part for process development and also in an application circuit to assess performance of 3D-IC thanks to the DFT infrastructure. This paper describes simulation and logic synthesis results of both implementations. |
Year | DOI | Venue |
|---|---|---|
2017 | 10.1109/NEWCAS.2017.8010128 | 2017 15th IEEE International New Circuits and Systems Conference (NEWCAS) |
Keywords | Field | DocType |
3D-IC,high density interconnects,Cu-Cu hybrid bonding,alignment,test vehicles,DFT | Contact resistance,Computer science,Interconnection density,High density,Electronic engineering,Three-dimensional integrated circuit,Sheet resistance,Process development,Integrated circuit,Electrical engineering,AND gate | Conference |
ISSN | ISBN | Citations |
2472-467X | 978-1-5090-4992-9 | 1 |
PageRank | References | Authors |
0.63 | 4 | 4 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Imed Jani | 1 | 1 | 1.30 |
| Didier Lattard | 2 | 144 | 18.68 |
| Pascal Vivet | 3 | 606 | 53.09 |
| Edith Beigne | 4 | 536 | 52.54 |