Name
Title | ||
|---|---|---|
Laser decapsulation of plastic packages for failure analysis: Process control and artefact investigations |
Abstract | ||
|---|---|---|
Laser ablation is a recent pre-decapsulation technique, which is used for sample preparation in failure analysis. This process works with speed and accuracy. These are key parameters for getting successful observation and defect localization. This can be used to have a precise opening on the die. However, this technique can create thermal stresses to the device. In order to minimize this stress, we have investigated methods for controlling the thermal effect of the laser on the component. This paper presents the experimental setup and the study of an electrical artefact that influences the interpretation of our thermal data. |
Year | DOI | Venue |
|---|---|---|
2008 | 10.1016/j.microrel.2008.07.004 | Microelectronics Reliability |
Keywords | DocType | Volume |
failure analysis,thermal stress,sample preparation,process control | Journal | 48 |
Issue | ISSN | Citations |
8 | 0026-2714 | 0 |
PageRank | References | Authors |
0.34 | 1 | 3 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| A. Aubert | 1 | 0 | 0.34 |
| L. Dantas de Morais | 2 | 0 | 1.69 |
| J.-P. Rebrassé | 3 | 0 | 0.68 |