Author Info
Name
Affiliation
Papers
J.-P. REBRASSÉ
Laboratory of Failure Analysis, ST Microelectronics, 16 rue Pierre et Marie Curie, 37071 Tours cedex 2, France
2
Collaborators
Citations 
PageRank 
5
0
0.68
Referers 
Referees 
References 
0
5
1
Title
Citations
PageRank
Year
Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing00.342010
Laser decapsulation of plastic packages for failure analysis: Process control and artefact investigations00.342008