Title
Impact Of Annealing Ambience On Resistive Switching In Pt/Tio2/Pt Structure
Abstract
Resistive switching of metal-insulator-metal (MIM), consisting of a metal-organic chemical vapour deposition (MOCVD) TiO2 layer sandwiched between Pt electrodes, has been measured systematically before and after thermal annealing in different ambiences. With H-2 annealing at 400 degrees C, the current level in the high-resistive state (FIRS) significantly decreased while little change in the low-resistive state (LRS) was observed. As a result, the switching ratio over 7 orders of magnitude at the current level was obtained. From the analysis of current-voltage (I-V) characteristics in HRS and LRS, we found that the LRS was characterized with an ohmic conduction, while in the HRS after H-2 annealing, charge trapping became significant as a result of a significant decrease in the current level. In a separate experiment, a partial reduction in TiO2 was detected using high-resolution X-ray photoelectron spectroscopy (XPS) after resistant-state switching from HRS to LRS by using a Hg probe as a top electrode, which is associated with filament formation.
Year
DOI
Venue
2011
10.1587/transele.E94.C.699
IEICE TRANSACTIONS ON ELECTRONICS
Keywords
DocType
Volume
ReRAM, TiO2, low temperature, H-2 annealing, charge trapping
Journal
E94C
Issue
ISSN
Citations 
5
1745-1353
0
PageRank 
References 
Authors
0.34
0
7
Name
Order
Citations
PageRank
Guobin Wei131.63
Yuta Goto231.63
Akio Ohta343.52
Katsunori Makihara446.33
Hideki Murakami596.82
Seiichiro Higashi644.20
Seiichi Miyazaki7810.52