Abstract | ||
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Virtual platforms are widely used for system-level modeling, design and simulation. In this paper, we propose a virtual platform-based, top-down, system-level design methodology for developing and testing hardware/software right from the concept level and even before the architecture is finalized. The methodology is based on using tools such as QEMU, SystemC and TLM2.0 that starts with a functional, high-level description of the system and gradually refines the intricate architectural details. We present our results by testing a novel concept aimed at performing audio blogging. The system under consideration involves the design of a low-power wearable audio recorder, an Android application for user interface and a server for audio analysis. A virtual system consisting of three instances of QEMU and other tools was created to demonstrate the concept and to test this approach. Finally, we describe a suite of tools useful for quickly validating concepts and creating virtual platforms for early hardware/software codesign. |
Year | DOI | Venue |
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2012 | 10.1109/ISQED.2012.6187531 | ISQED |
Keywords | DocType | ISSN |
Web sites,audio recording,graphical user interfaces,hardware description languages,hardware-software codesign,low-power electronics,operating systems (computers),program testing,virtual reality,Android application,QEMU,SystemC,TLM2.0,audio analysis,audio blogging,concept development,concept validation,hardware-software codesign,hardware-software development,hardware-software testing,high-level system description,low-power wearable audio recorder,system-level design,system-level modeling,system-level simulation,top-down design methodology,user interface,virtual platforms,Android,QEMU,SystemC,TLM2.0,Virtual Platforms | Conference | 1948-3287 |
Citations | PageRank | References |
3 | 0.41 | 5 |
Authors | ||
4 |
Name | Order | Citations | PageRank |
---|---|---|---|
Mohit Shah | 1 | 27 | 3.11 |
Brian Mears | 2 | 3 | 0.41 |
Chaitali Chakrabarti | 3 | 1978 | 184.17 |
Andreas S. Spanias | 4 | 528 | 87.90 |