Paper Info
Title
High-frequency mutual impedance extraction of VLSI interconnects in the presence of a multi-layer conducting substrate
Abstract
We propose a computationally efficient method to calculate, with high accuracy, the mutual impedance between two wires in the presence of multilayer substrates, as needed for high frequency CAD applications. The resulting accuracy (errors smaller than 2%) and CPU time reduction (factors of seven) emerge from three different ingredients: a two dimensional Green's function approach with the correct quasi-static limit, a modified discrete complex image approximation to the Green's function, and a novel discrete dipole approximation to evaluate the magnetic vector potential. This approach permits the evaluation of the mutual impedance between two loops in terms of easily computable analytical expressions that involve the relative separations and the electromagnetic parameters of the multi-layer substrate. The results are valid for long wires, for any separation, and for frequencies up to 100 GHz.
Year
DOI
Venue
2008
10.1145/1403375.1403478
design, automation, and test in europe
Keywords
Field
DocType
computable analytical expression,dimensional green,mutual impedance,high frequency cad application,vlsi interconnects,novel discrete dipole approximation,modified discrete complex image,high-frequency mutual impedance extraction,cpu time reduction,function approach,resulting accuracy,high accuracy,very large scale integration,error correction,discrete dipole approximation,accuracy,frequency,impedance,high frequency,magnetic vector potential,vlsi,active power
Substrate (chemistry),CAD,Topology,Expression (mathematics),Computer science,CPU time,Parallel computing,Electronic engineering,AC power,Magnetic potential,Discrete dipole approximation,Very-large-scale integration
Conference
ISSN
Citations 
PageRank 
1530-1591
1
0.46
References 
Authors
4
3
Name
Order
Citations
PageRank
Navin Srivastava112614.70
Roberto Suaya2197.27
Kaustav Banerjee3828107.56