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Fast High-Frequency Impedance Extraction of Horizontal Interconnects and Inductors in 3-D ICs With Multiple Substrates | 2 | 0.80 | 2012 |
An efficient framework for passive compact dynamical modeling of multiport linear systems | 1 | 0.38 | 2012 |
High-frequency mutual impedance extraction of VLSI interconnects in the presence of a multi-layer conducting substrate | 1 | 0.46 | 2008 |
Efficient implementation of conduction modes for modelling skin effect | 1 | 0.40 | 2007 |
Fullwave volumetric Maxwell solver using conduction modes | 2 | 0.42 | 2006 |
Mutual inductance between intentional inductors: closed form expressions | 0 | 0.34 | 2006 |
Panel I: who is responsible for the design for manufacturability issues in the era of nano-technologies? | 0 | 0.34 | 2005 |
Mutual inductance extraction and the dipole approximation | 0 | 0.34 | 2004 |
Transmission line design of clock trees | 9 | 0.81 | 2002 |
A two-dimensional topological compactor with octagonal geometry | 3 | 2.64 | 1991 |