Name
Title | ||
|---|---|---|
Improved estimation of the resistivity of pure copper and electrical determination of thin copper film dimensions |
Abstract | ||
|---|---|---|
Improved values for the resistivity, ρ, of pure, bulk copper from 50 to 1200 K, and their confidence intervals, are developed by extending the analysis of Matula. A recommended value for dρ/dT and its confidence interval in the temperature range of 290–425 K is developed for use with Matthiessen's rule to calculate the electrical thickness of thin copper films and the cross-sectional area of copper lines from resistance measurements at two temperatures. Error analyses are used to estimate the uncertainty with which the electrical thickness and cross-sectional area can be determined. Values for the temperature coefficient of resistance of pure, bulk copper are also provided. |
Year | DOI | Venue |
|---|---|---|
2001 | 10.1016/S0026-2714(00)00227-4 | Microelectronics Reliability |
Keywords | Field | DocType |
cross sectional area,temperature coefficient of resistance,confidence interval,copper | Atmospheric temperature range,Temperature coefficient,Electrical measurements,Electronic engineering,Engineering,Confidence interval,Integrated circuit,Electrical resistivity and conductivity,Copper | Journal |
Volume | Issue | ISSN |
41 | 2 | 0026-2714 |
Citations | PageRank | References |
3 | 1.04 | 0 |
Authors | ||
3 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Constance E. Schuster | 1 | 3 | 1.04 |
| Mark G. Vangel | 2 | 6 | 3.89 |
| Harry A. Schafft | 3 | 4 | 2.20 |