Title
A methodology for interconnect dimension determination
Abstract
The determination of metal wire dimensions and inter-layer dielectric thicknesses has become increasingly important in recent times, as wire delays have begun to dominate transistor delays. In this paper, we propose metrics to guide the determination of these dimensions, along with results which describe the efficacy of these metrics. The first metric, which we refer to as cross-bar bandwidth(CBB), compares different wiring configurations in terms ofthe resulting bandwidth they can support in a square of unitsize. The second metric, called power-adjusted cross-bar bandwidth (PCBB), measures the bandwidth of a square, while accounting for the power consumed by the interconnect in the square. The application of these metrics suggests that the traditional approach (of fabricating interconnect of the finest pitch possible) may be sub-optimal with respect to either metric that we present. We have conducted our experiments for layers METAL1 through METAL4, although the approach is general and can be applied to the problem of determining interconnect dimensions for any layer. Without considering driver resistance, our approach yields up to 16% improvement in CBB and 19% improvement in PCBB. When drivers are modeled, the improvements are even greater.
Year
DOI
Venue
2007
10.1145/1231996.1232038
International Symposium on Physical Design
Keywords
Field
DocType
traditional approach,dimension determination,driver resistance,inter-layer dielectric thickness,approach yield,different wiring configuration,wire delay,cross-bar bandwidth,power-adjusted cross-bar bandwidth,finest pitch,metal wire dimension,clustering
Mathematical optimization,Dielectric,Computer science,Electronic engineering,Bandwidth (signal processing),Cluster analysis,Interconnection,Transistor,Clock tree synthesis
Conference
Citations 
PageRank 
References 
0
0.34
3
Authors
3
Name
Order
Citations
PageRank
Jeff Cobb160837.52
Rajesh Garg2768.45
Sunil P. Khatri31213137.09