Name
Abstract | ||
|---|---|---|
Electromigration behavior in a one-dimensional Cu/Sn–8Zn–3Bi/Cu solder joint structure was investigated in ambient with a current density of 3.5×104 A/cm2 at 60°C. Due to the compressive stress induced by volume expansion resulting from Cu–Zn intermetallic compound (IMC) growth, Cu5Zn8 IMC layers were squeezed out continuously along IMC/Cu interfaces at both the anode and the cathode with increasing the current stressing time, which was not only driven by the concentration gradient, but also accelerated by the electromigration. And a few voids propagated and formed at the anode and the cathode solder/IMC interfaces during electromigration. Additionally, Sn hillocks occurred in the bulk solder, and Sn hillocks formed at the anode side were larger than those at the cathode side. |
Year | DOI | Venue |
|---|---|---|
2010 | 10.1016/j.microrel.2009.09.018 | Microelectronics Reliability |
Keywords | Field | DocType |
current density,intermetallic compound,electromigration | Current density,Intermetallic,Anode,Soldering,Metallurgy,Engineering,Void (astronomy),Electromigration,Cathode,Hillock | Journal |
Volume | Issue | ISSN |
50 | 2 | 0026-2714 |
Citations | PageRank | References |
0 | 0.34 | 0 |
Authors | ||
5 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Lijuan Liu | 1 | 0 | 0.68 |
| Wei Zhou | 2 | 0 | 0.34 |
| Hongbo Zhang | 3 | 14 | 5.68 |
| Baoling Li | 4 | 8 | 1.34 |
| Ping Wu | 5 | 0 | 0.68 |