Author Info
Name
Affiliation
Papers
PING WU
Corresponding author. Address: Department of Applied Physics, Faculty of Science, Tianjin University, Tianjin 300072, PR China. Tel./fax: +86 22 27406852.
2
Collaborators
Citations 
PageRank 
5
0
0.68
Referers 
Referees 
References 
0
0
0
Title
Citations
PageRank
Year
Effects of Cu on the interfacial reactions between Sn-8Zn-3Bi-xCu solders and Cu substrate.00.342014
Electromigration behavior in Cu/Sn–8Zn–3Bi/Cu solder joint00.342010