Paper Info
Title
Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures.
Abstract
The local interfacial strength is a key factor in designing and fabricating advanced three-dimensional large-scale integration interconnect structures. In this paper, both local fracture tests and three-dimensional elastic–plastic crack propagation analysis for a 10μm×10μm specimen were performed, and the local interfacial adhesion between a Cu interconnect and a SiN cap layer were evaluated. The three-dimensional elastic–plastic crack propagation simulation was developed to evaluate the interfacial adhesion that eliminated the effect of progressive plastic dissipation energy during crack propagation. The results show that the average interfacial adhesion for Cu/SiN is 4.46±0.17J/m2. The crack propagation behavior and fracture pattern depend on the interfacial adhesion, and these differences are due to the plastic yielding of the side edge of the specimen. The critical interfacial adhesion for the onset of shear fracture is 4.92J/m2, which is the upper bound of the interfacial adhesion evaluation for the 10μm×10μm specimen.
Year
DOI
Venue
2013
10.1016/j.microrel.2012.12.009
Microelectronics Reliability
Field
DocType
Volume
Composite material,Shear (sheet metal),Dissipation,Yield (engineering),Electronic engineering,Adhesion,Fracture mechanics,Engineering,Numerical analysis,Interconnection,Silicon nitride,Structural engineering
Journal
53
Issue
ISSN
Citations 
4
0026-2714
0
PageRank 
References 
Authors
0.34
0
11
Name
Order
Citations
PageRank
Masaki Omiya1185.91
Kozo Koiwa200.68
Nobuyuki Shishido301.01
Shoji Kamiya400.68
Chuantong Chen500.68
Hisashi Sato600.68
Masahiro Nishida712.07
Takashi Suzuki801.01
Tomoji Nakamura932.07
Toshiaki Suzuki1000.68
Takeshi Nokuo1100.68