Author Info
Name
Affiliation
Papers
TOMOJI NAKAMURA
Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, Atsugi, Kanagawa 243-0197, Japan
5
Collaborators
Citations 
PageRank 
20
3
2.07
Referers 
Referees 
References 
16
16
3
Title
Citations
PageRank
Year
Scenario for catastrophic failure in interconnect structures under chip package interaction00.342015
Characterization of stress distribution in ultra-thinned DRAM wafer00.342015
Impact of Thermomechanical Stresses on Ultra-thin Si Stacked Structure10.482014
Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures.00.342013
Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures.20.582011