Name
Year | DOI | Venue |
|---|---|---|
1995 | 10.1109/TEST.1995.529832 | ITC |
Keywords | Field | DocType |
novel low-cost approach,mcm interconnect test,test methods,fault coverage,packaging,electron beam,functional test,assembly,transfer functions,transfer function,integrated circuit packaging,fault detection,testing,capacitance | Cost approach,Capacitance,Fault coverage,Fault detection and isolation,Computer science,Integrated circuit packaging,Electronic engineering,Transfer function,Attenuation,Interconnection | Conference |
ISBN | Citations | PageRank |
0-7803-2992-9 | 13 | 1.71 |
References | Authors | |
7 | 4 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Bruce C. Kim | 1 | 89 | 21.11 |
| Abhijit Chatterjee | 2 | 1949 | 269.99 |
| madhavan swaminathan | 3 | 108 | 24.63 |
| David E. Schimmel | 4 | 375 | 44.61 |