Title
Low-cost signature test of RF blocks based on envelope response analysis
Abstract
This paper presents a novel and low-cost methodology that can be used for testing RF blocks embedded in complex SoCs. It is based on the detection and analysis of the two-tone response envelope of the device under test (DUT). The response envelope is processed to obtain a simple digital signature sensitive to key specifications of the DUT. The analytical basis of the proposed methodology is demonstrated, and a proposal for its implementation as a built-in test core is discussed. Finally, practical simulation examples show the feasibility of the approach.
Year
DOI
Venue
2010
10.1109/ETSYM.2010.5512780
Test Symposium
Keywords
Field
DocType
built-in self test,integrated circuit testing,radiofrequency integrated circuits,system-on-chip,RF block testing,SoC,built-in test core,device under test,low-cost signature test,two-tone response envelope analysis,RF BIST,RF test,Signature test
Response analysis,Transceiver,System on a chip,Device under test,Computer science,Radio frequency,Electronic engineering,Modulation,Digital signature,Built-in self-test
Conference
ISSN
ISBN
Citations 
1530-1877 E-ISBN : 978-1-4244-5833-2
978-1-4244-5833-2
2
PageRank 
References 
Authors
0.43
0
6
Name
Order
Citations
PageRank
Manuel J. Barragan Asian1537.27
Rafaella Fiorelli25711.24
Diego Vázquez313615.33
Adoración Rueda427540.01
José Luis Huertas5779.97
Barragan, M.J.620.43