Name
Abstract | ||
|---|---|---|
The reliability of RF MEMS switches is closely linked to their operational and environmental conditions. This paper examines the reliability of five different capacitive switch designs by a combined use of modeling and experimental tools. Three-dimensional multiphysics finite element analysis was performed to estimate the actuation voltage and deflection vs. temperature variations of the micro-switches. The effect of temperature and temperature cycles on switch dilatation and pull-in voltage are studied, as well as the influence of different operational signals on switch reliability. |
Year | DOI | Venue |
|---|---|---|
2005 | 10.1016/j.microrel.2005.07.095 | Microelectronics Reliability |
Keywords | Field | DocType |
three dimensional,finite element analysis | Deflection (engineering),Thermal,Multiphysics,Microelectromechanical systems,Voltage,Finite element method,Electronic engineering,Capacitive sensing,Engineering,Numerical analysis,Electrical engineering | Journal |
Volume | Issue | ISSN |
45 | 9 | 0026-2714 |
Citations | PageRank | References |
2 | 0.54 | 0 |
Authors | ||
8 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Q.-H. Duong | 1 | 76 | 7.00 |
| L. Buchaillot | 2 | 2 | 1.21 |
| D. Collard | 3 | 3 | 1.91 |
| P. Schmitt | 4 | 2 | 0.54 |
| X. Lafontan | 5 | 6 | 3.30 |
| P. Pons | 6 | 49 | 18.02 |
| F. Flourens | 7 | 3 | 1.62 |
| F. Pressecq | 8 | 6 | 3.32 |