Title
Known Godd Die for MCMs: Enabling Technologies
Year
DOI
Venue
1993
10.1109/TEST.1993.470693
ITC
Keywords
Field
DocType
enabling technologies,chip,microelectronics,reliability,ics,satisfiability,die,thermal stress,solids,performance,rapid thermal processing,transistors,assembly,performance testing,test methods,testing
Computer science,Rapid thermal processing,Chip,Electronic engineering
Conference
ISBN
Citations 
PageRank 
0-7803-1430-1
0
0.34
References 
Authors
0
1
Name
Order
Citations
PageRank
David C. Keezer16817.00