Paper Info
Title
Fast High-Frequency Impedance Extraction of Horizontal Interconnects and Inductors in 3-D ICs With Multiple Substrates
Abstract
We present a high-frequency impedance extraction method for horizontal interconnects as needed in 3-D integrated circuits (ICs), where the horizontal interconnects are sandwiched between substrate layers of possibly different electromagnetic parameters. In particular, for the first time, we develop an extension of the discrete complex images method based on a 2D, or alternatively, 3D magneto-quasi-static (MQS) vector potential Green's functions to extract analytical solutions to the series impedance (resistance and inductance) matrix elements for wire filaments. We then follow standard methods to extract the port impedance. Using the 2D approach, the series impedance per unit length of horizontal wire loops is obtained, which shows excellent accuracy (${
Year
DOI
Venue
2012
10.1109/TCAD.2012.2203598
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Keywords
DocType
Volume
Substrates,Green's function methods,Impedance,Vectors,Integrated circuit modeling,Equations,Wires
Journal
31
Issue
ISSN
Citations 
11
0278-0070
2
PageRank 
References 
Authors
0.80
10
4
Name
Order
Citations
PageRank
Chuan Xu114022.01
Navin Srivastava212614.70
Roberto Suaya3197.27
Kaustav Banerjee4828107.56