Name
Title | ||
|---|---|---|
Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects. |
Abstract | ||
|---|---|---|
•Dynamic simulation of the diffusion paths in interconnects in the consideration of crystal grains show a possible void formation.•The distribution of different Crystal grains in the interconnects influence the lifetime.•The simulation of interconnects with the consideration of manufacturing process help to understand the failure mechanism. |
Year | DOI | Venue |
|---|---|---|
2013 | 10.1016/j.microrel.2013.07.097 | Microelectronics Reliability |
Field | DocType | Volume |
Mass flux,Electronic engineering,Back end of line,Electronics,Engineering,Electromigration,Void (astronomy),Grain boundary,Integrated circuit,Dynamic simulation | Journal | 53 |
Issue | ISSN | Citations |
9 | 0026-2714 | 0 |
PageRank | References | Authors |
0.34 | 5 | 6 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Aymen Moujbani | 1 | 0 | 0.34 |
| Jörg Kludt | 2 | 0 | 2.03 |
| Kirsten Weide-Zaage | 3 | 31 | 14.97 |
| Markus Ackermann | 4 | 22 | 3.63 |
| Verena Hein | 5 | 1 | 2.46 |
| Lutz Meinshausen | 6 | 8 | 3.47 |