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LUTZ MEINSHAUSEN
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Name
Affiliation
Papers
LUTZ MEINSHAUSEN
Laboratoire IMS, Université Bordeaux I, 351 Cours de la Libération, 33405 Talence Cedex, France
8
Collaborators
Citations
PageRank
9
8
3.47
Referers
Referees
References
5
52
27
Publications (8 rows)
Collaborators (9 rows)
Referers (5 rows)
Referees (52 rows)
Title
Citations
PageRank
Year
Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps.
1
0.41
2015
Dynamical IMC-growth calculation
0
0.34
2015
Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads.
1
0.41
2013
Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects.
0
0.34
2013
Electro- and thermo-migration induced failure mechanisms in Package on Package.
1
0.45
2012
Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers.
1
0.45
2012
Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps.
4
0.72
2011
Influence of air gaps on the thermal-electrical-mechanical behavior of a copper metallization.
0
0.34
2011
1