Title
A Die Selection and Matching Method with Two Stages for Yield Enhancement of 3-D Memories
Abstract
Three-dimensional (3-D) memories using through-silicon-vias (TSVs) as vertical buses across memory layers has regarded as one of 3-D integrated circuits (ICs) technology. The memory dies to stack together in a 3-D memory are selected by a die selection method. In order to improve yield of 3-D memories, redundancy sharing between inter-die using TSVs is an effective strategy. With the redundancy sharing strategy, the bad memory dies can become good 3-D memories through matching the good memory dies. To support die selection and matching efficiently, a novel redundancy analysis (RA) algorithm, which considers various repair solutions, is proposed. Because the repair solutions can be various, the proposed die selection and matching is performed with two stages; general die selection and matching method in the first stage and re-matched remained memory dies, after the first stage, applying other repair solutions in the second stage. Thus, the proposed die selection and matching algorithm using the proposed RA algorithm can improve yield of 3-D memories. The experimental results show that the proposed die selection and matching method can achieve higher yield of 3-D memories than that of the previous state-of-the-art the die selection and matching methods.
Year
DOI
Venue
2013
10.1109/ATS.2013.62
Asian Test Symposium
Keywords
Field
DocType
3-d integrated circuit,repair solution,matching method,proposed die selection,good 3-d memory,3-d memories,yield enhancement,general die selection,matching algorithm,3-d memory,die selection method,die selection
Semiconductor memory,Bad memory,Computer science,Parallel computing,Electronic engineering,Die (manufacturing),Redundancy (engineering),Integrated circuit,Blossom algorithm,Memory refresh
Conference
ISSN
Citations 
PageRank 
1081-7735
1
0.36
References 
Authors
11
4
Name
Order
Citations
PageRank
Wooheon Kang1223.46
Changwook Lee2207.88
Keewon Cho3184.64
Sungho Kang443678.44