Abstract | ||
---|---|---|
The increasing prominence of portable systems and the need to limit power consumption and hence, heat dissipation in very high density VLSI chips have led to rapid and innovative developments in low power design recently. Leakage control is becoming critically important for deep sub-100nm technologies due to the scaling down of threshold voltage and gate oxide thickness of transistors. In this paper, we discuss major sources of power dissipation in VLSI systems, and various low power design techniques on the technology and circuit level, logic level, and system level. |
Year | DOI | Venue |
---|---|---|
2003 | 10.1145/871506.871558 | ISLPED |
Keywords | Field | DocType |
circuit level,system level,vlsi chip,power dissipation,heat dissipation,vlsi system,integrated system,various low power design,power consumption,low power design,logic level,cmos,integrated circuit design,integrated circuit,integrable system,low power electronics,chip,threshold voltage,vlsi | Leakage (electronics),Computer science,CMOS,Electronic engineering,Integrated circuit design,Logic level,Transistor,Very-large-scale integration,Electrical engineering,AND gate,Low-power electronics | Conference |
ISBN | Citations | PageRank |
1-58113-682-X | 5 | 0.55 |
References | Authors | |
21 | 1 |
Name | Order | Citations | PageRank |
---|---|---|---|
Sung-Mo Steve Kang | 1 | 1198 | 213.14 |