Paper Info
Title
Teaching three-dimensional system-in-package design automation in a semester course
Abstract
In recent years, three-dimensional (3D) system-in-package (SiP) has been widely recognized as a cost-effective alternative to system-on-chip (SoC). However, successful adoption of 3D SiP requires modifications to existing electronic design automation (EDA) tools to enable 3D SiP designs. Our previous courses focus on SoC design flow. Therefore, in our department, we develop a new course to offer students the concepts and experiences for 3D SiP design automation within a semester (18 weeks). Our teaching materials cover the overall 3D SiP design flow from front-end to back-end. Furthermore, during the course, students need to implement five computer-aided-design (CAD) tools for 3D SiP design automation. At the end of the semester, the evaluation of the course by students is very positive. Moreover, our students used the topic of 3D SiP design automation to participate in Taiwan IC/CAD contest, which is a national contest hosted by Ministry of Education of Taiwan, and won the first prize awards in recent two years.
Year
DOI
Venue
2011
10.1109/MSE.2011.5937091
MSE
Keywords
Field
DocType
eda tools,new course,semester course,cad,course development,system-in-package,national contest,soc,electronic engineering education,electronic design automation tools,educational courses,three-dimensional system-in-package design automation,sip design,sip design flow,three-dimensional integrated circuits,3d sip design automation,teaching,sip design automation,three-dimensional integrated circuits (3d ics),previous course,system-on-chip,cad contest,teaching experience,computer-aided-design tools,taiwan ic,soc design flow,electronic design automation,computer-aided design,system on chip,system in package,system on a chip,integrated circuit,design automation,three dimensional,computer aided design,through silicon via
System in package,Christian ministry,CONTEST,Computer Aided Design,Electronic engineering education,Design flow,Electronic design automation,Engineering,Computer engineering
Conference
ISBN
Citations 
PageRank 
978-1-4577-0550-2
0
0.34
References 
Authors
8
4
Name
Order
Citations
PageRank
Shih-Hsu Huang120338.89
Wen-Pin Tu2214.32
Hua-Hsin Yeh322.52
Chun-Hua Cheng45912.00