Name
Title | ||
|---|---|---|
Thermal analysis of 3D integrated circuits based on discontinuous Galerkin finite element method |
Abstract | ||
|---|---|---|
Even though vertical 3D integration offers increased device density, reduced signal delay, and design flexibility, heat and thermal concerns are, nevertheless, aggravated. In this context, accurate computation of temperature profile is required to establish thermal design rules governing the feasibility of integration options. Within this framework, a novel methodology based on discontinuous Galerkin finite element method for accurate thermal profile estimation of 3D integrated circuits is proposed. The method is utilized to simulate geometrically complicated physical structures with limited complexity overhead. |
Year | DOI | Venue |
|---|---|---|
2012 | 10.1109/ISQED.2012.6187483 | Quality Electronic Design |
Keywords | Field | DocType |
Galerkin method,finite element analysis,integrated circuit design,thermal management (packaging),three-dimensional integrated circuits,3D integrated circuit,discontinuous Galerkin finite element method,temperature profile,thermal design rule,thermal profile estimation,vertical 3D integration,3D IC,Adaptive error control,CAD,Multi-layer,Simulation,Thermal analysis | Discontinuous Galerkin method,Thermal,Computer science,Galerkin method,Finite element method,Electronic engineering,Integrated circuit design,Three-dimensional integrated circuit,Integrated circuit,Computation | Conference |
ISSN | ISBN | Citations |
1948-3287 | 978-1-4673-1034-5 | 5 |
PageRank | References | Authors |
0.43 | 11 | 5 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Amir Zjajo | 1 | 57 | 20.08 |
| Nick van der Meijs | 2 | 30 | 7.49 |
| Rene van Leuken | 3 | 111 | 20.72 |
| van der Meijs, N. | 4 | 5 | 0.43 |
| van Leuken, R. | 5 | 26 | 4.14 |