Name
Title | ||
|---|---|---|
ESD-Induced Internal Core Device Failure: New Failure Modes in System-on-Chip (SoC) Designs, invited |
Abstract | ||
|---|---|---|
With MOSFET scaling, increased design complexity, and multiple system power domains, ESD failures occur in internal core areas which are not connected to external package pins. A review of the various internal core device failure mechanisms and design recommendations will be presented. |
Year | DOI | Venue |
|---|---|---|
2005 | 10.1109/IWSOC.2005.58 | IWSOC |
Keywords | DocType | ISBN |
New Failure Modes,external package pin,increased design complexity,various internal core device,design recommendation,failure mechanism,multiple system power domain,ESD failure,ESD-Induced Internal Core Device,MOSFET scaling,internal core area | Conference | 0-7695-2403-6 |
Citations | PageRank | References |
1 | 0.38 | 0 |
Authors | ||
7 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Yoon Huh | 1 | 1 | 0.38 |
| Peter Bendix | 2 | 1 | 0.38 |
| Kyung-jin Min | 3 | 4 | 0.77 |
| Jau-wen Chen | 4 | 7 | 1.65 |
| Ravindra Narayan | 5 | 1 | 0.38 |
| Larry D. Johnson | 6 | 1 | 0.38 |
| Steven H. Voldman | 7 | 5 | 2.38 |